Headers & Wire Housings - Inix Electronic

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54 Produkt

Modell	Anzahl		Hersteller	Beschreibung	Series	Packaging	Operating Temperature Range	Current Rating	Voltage Rating	Number of Positions	Number of Rows	Contact Material	Row Spacing	Connector Type	Mounting Type	Contact Type	Features	Style	Termination	Insulation Material	Description
2010225218	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010225118	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010225018	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010224218	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010224118	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010224018	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010223218	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010223118	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010223018	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010222218	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	-	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010222118	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	-	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010222018	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	-	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010221218	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	-	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010221118	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	-	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010221018	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	-	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010220218	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	-	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010220118	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	-	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010220018	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201022	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole	Male Pin	-	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010215268	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Board Guide, Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010215218	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010215168	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Board Guide, Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010215118	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010215068	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Board Guide, Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010215018	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010214268	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Board Guide, Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010214218	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010214168	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Board Guide, Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010214118	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010214068	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Board Guide, Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T
2010214018	Ein Angebot siehe	PDF RFQ	Molex, LLC	SLIM-GRID HEADER, 18 CIRCUITS, T	Slim-Grid 201021	Tube	-55°C ~ 105°C	-	125V	All	2	Copper Alloy	0.050" (1.27mm)	Header	Through Hole, Right Angle	Male Pin	Pick and Place	Board to Board	Solder	Liquid Crystal Polymer (LCP), Glass Filled	SLIM-GRID HEADER, 18 CIRCUITS, T

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