- Insulation Material :
- Ausgewählter Filter :
3 Produkt
| Bild | Modell | Preis | Anzahl | Lager | Hersteller | Beschreibung | Series | Packaging | Current Rating | Number of Positions | Number of Rows | Contact Material | Row Spacing | Connector Type | Mounting Type | Contact Type | Features | Style | Termination | Insulation Material | Description | |
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siehe | Molex, LLC | CONN HEADER 8POS 3MM RT ANG TIN | Micro-Fit 3.0 BMI 44428 | Tray | - | All | 2 | Brass | 0.118" (3.00mm) | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Board or Cable | Solder | Polyamide (PA), Nylon, Glass Filled | CONN HEADER 8POS 3MM RT ANG TIN | |||
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Ein Angebot |
2,311
Verfügbar auf Lager
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Molex, LLC | CONN HEADER 8POS 3MM RT ANG TIN | Micro-Fit 3.0 43650 | Tray | - | All | 1 | Brass | - | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | CONN HEADER 8POS 3MM RT ANG TIN | ||
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Ein Angebot |
6,771
Verfügbar auf Lager
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Molex, LLC | CONN HEADER 8POS 3MM RT ANG TIN | Micro-Fit 3.0 43045 | Tray | - | All | 2 | Brass | 0.118" (3.00mm) | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | CONN HEADER 8POS 3MM RT ANG TIN |
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